View of PVDM3-256 Cisco 256-Channel High Density Voice and Video DSP Module

PVDM3-256 Cisco 256-Channel High Density Voice and Video DSP Module

Cisco

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Cisco PVDM3-256 256-Channel High-Density Voice and Video DSP Module

Advanced Cisco PVDM3-256 DSP Module for High-Capacity Voice, Video, and Conferencing Services

The Cisco PVDM3-256 DSP Module is a high-density digital signal processor module designed for Cisco Integrated Services Routers (ISR), delivering advanced voice and video processing capabilities for enterprise unified communications environments. Engineered for high-performance VoIP and collaboration deployments, it supports up to 256 voice channels for scalable enterprise and service provider applications.

Built on advanced multicore DSP architecture, the PVDM3-256 provides significantly improved performance and processing density compared to earlier DSP generations. It supports a wide range of voice and media services including conferencing, transcoding, echo cancellation, voice compression, and media processing, enabling efficient unified communications operations within Cisco ISR platforms.

The module supports multiple industry-standard codecs such as G.711, G.729, G.722, and iLBC, ensuring compatibility and flexibility across diverse VoIP and collaboration environments. It also enables conference sessions with up to 64 participants, making it ideal for enterprise conferencing and collaboration solutions.

Designed for integration with Cisco 2900 and 3900 Series ISR routers, the PVDM3-256 supports Cisco Unified Communications deployments, SIP trunking, and advanced voice gateway applications. Its compact DIMM-based form factor allows easy installation while maintaining low power consumption of approximately 4.85W.

Ideal for enterprise VoIP systems, unified communications deployments, voice gateways, conferencing solutions, contact centers, and service provider voice infrastructures, the Cisco PVDM3-256 delivers scalable, reliable, and high-performance DSP processing for modern collaboration environments.

Product Specifications – Cisco PVDM3-256 High-Density DSP Module
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Specification Details
Product Name Cisco PVDM3-256 DSP Module
Manufacturer Cisco Systems
Part Number PVDM3-256
Product Type DSP Module (Voice & Video Processing)
DSP Generation PVDM3
Channel Capacity Up to 256 Voice Channels
DSP Architecture Multicore DSP Technology
Memory Type DDR SDRAM per DSP
Module Interface DIMM-based plug-in module
Supported Codecs G.711, G.729, G.722, iLBC, and others
Voice Functions Conferencing, transcoding, echo cancellation, voice compression
Conference Capacity Up to 64 participants per session
Fax Support T.38 Fax Relay
Voice Compression Supported
Echo Cancellation Hardware-assisted echo cancellation
Media Processing Voice and video DSP processing
Compatibility Cisco 2900 and 3900 Series ISR Routers
Unified Communications Support Cisco Unified Communications Manager environments
SIP Support Yes
VoIP Support Yes
Power Consumption Approx. 4.85W
Hot-Swappable No
Form Factor Plug-in DSP module
Reliability Enterprise-grade voice processing
Performance High-density DSP processing for UC deployments
Scalability Supports enterprise-scale voice deployments
Application Unified communications, VoIP, conferencing
Deployment Type Enterprise voice gateways and collaboration systems
Environment Enterprise and service provider deployments
Condition New / Cisco Certified
Use Cases VoIP systems, conferencing, contact centers, SIP trunking

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FAQs

Q1. What is the main function of the PVDM3-256 module?
It provides DSP resources for voice processing tasks such as conferencing, transcoding, and compression.

Q2. How many voice channels does it support?
It supports up to 256 voice channels depending on codec complexity.

Q3. Which routers are compatible with this module?
It is compatible with Cisco 2900 and 3900 Series Integrated Services Routers.

Q4. Can it handle conferencing and transcoding?
Yes, it supports both conferencing and transcoding functions within the same DSP module.

Q5. How is it better than previous PVDM modules?
It offers higher density, better performance, and support for more advanced voice and video applications.


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